ABL HEATSINKS BGA-STD-045 Heat Sink, For Ball Grid Array, Standard, BGA, 14.7 �C/W, 18 mm, 23 mm, 23 mm HoldFast Gear CL02-TN 0 Series Wire Size AWG

0 Series Wire Size AWG Min 24AWG Other details

1210 product from EPCOS with the model number B72650M0500K072Product details

Brand MAXIM INTEGRATED PRODUCTS Part Number MAX6960ATH+ Quantity Each Technical Data Sheet EN

Dolgin Engineering TC400-TDM Four-Position Simultaneous Battery Charger for Canon BP-A30 and BP-A60

APS-C Picture Angle: 124

ABL HEATSINKS BGA-STD-045 Heat Sink, For Ball Grid Array, Standard, BGA, 14.7 �C/W, 18 mm, 23 mm, 23 mm HoldFast Gear CL02-TN 0 Series Wire Size AWGThe BGA STD 045 is a 23 x 23 x 18mm standard Heat Sink with thermal tape. This heat sink is made of aluminium with black anodized finish and vertically mounted fin. This BGA series heat sink is suitable for use with ball grid array. Applications Industrial Product details External Diameter Metric Packages Cooled BGA Heat Sink Material Aluminium Thermal Resistance 14. 7C W External Length Imperial 0. 906" External Length Metric 23mm External Width