AMP - TE CONNECTIVITY 5103308-1 Wire-To-Board Connector, 2.54 mm, 10 Contacts, Header, AMP-LATCH Series, Through Hole, 2 Rows Sescom IPHONE-MIC-10 The CY7C199D device is suitable

The CY7C199D device is suitable for interfacing with processors that have TTL I/P levels

the binocular housing is made from a combination of polycarbonate polymer and aluminum

8" (94-103 x 25 cm) (LxDiameter) Accommodates 150mm long tripod with spreader Carrying/Transport Options Handle Weight 8

It is employed when rapid mounting and dismounting is required with large

On the device is also an AF assist beam to help in low-light conditions

AMP - TE CONNECTIVITY 5103308-1 Wire-To-Board Connector, 2.54 mm, 10 Contacts, Header, AMP-LATCH Series, Through Hole, 2 Rows Sescom IPHONE-MIC-10 The CY7C199D device is suitableThe 5103308 1 is a 10 way AMP LATCH shrouded Low Profile Header with flame retardant. It has 5000MR minimum initial insulation resistance and 1000Vrms dielectric withstanding voltage. It has low profile and wire to board connector system. Vertical PCB mounting Glass filled nylon PBT housing material Gold plated copper alloy contacts UL94V 0 flammability rating Applications Industrial, Consumer Electronics Product details No. of Contacts 10Contacts